From Newsgroup: sci.physics

Hi,

"Mobile HBM" refers to a new, under-development
form of High Bandwidth Memory (HBM) optimized
specifically for energy-efficient mobile devices
like smartphones. Manufacturers such as Samsung
and SK Hynix are developing this technology to
make the massive data bandwidth required for complex,
on-device AI applications available within the strict
power and space constraints of mobile phones.

Unlike classic HBM solutions, which rely on
extra-wide silicon interposers for massive data
throughput in data centers and graphics cards,
Mobile HBM utilizes stacked LPDDR architectures.
The goal is to drastically reduce power consumption
and heat generation so that large AI models can
run directly on the device (on-device) without
placing too heavy a load on the battery. The
technology is expected to hit the market starting
in 2026/2027, with Apple among those showing great
interest in integrating it into future iPhone generations."

https://www.remio.ai/post/mobile-hbm-the-ai-memory-tech-that-could-reshape-the-iphone

Just think of a Mac Neo, which has now 8 GB,
but the memory going 3D in 12 layers, thats a
massive of 96 GB very fast memory.

Economy of scale comes later, when the same CPU/
GPU/RAM combo is used for phones, tablets, desktop,
or with other humidity and temperature parameters

for cars, robots, drones, etc...

Bye

Mild Shock schrieb:

Hi,

For marketing purposes people
typically look at the race towards
2nm, and we find:

A month ago, Apple lost its exclusivity
on 3 nm smartphone processors with
MediaTekrCOs Dimensity 9400 chip, integrated
in the Vivo X200 Pro smartphone. Qualcomm
is also in the race with its recently
unveiled Snapdragon 8 Elite and set to
power the Xiaomi 15 Pro in 2025. However,
Apple should regain its position as innovation
leader in 2026 with the release of the
iPhone 18, which should feature the A20
chip built on TSMCrCOs 2 nm process."

But there is a vertical vias revolution
going on as well, some SOCs typically
being at 18 layers now:

Zooming Into a CPU (It's Incredible) https://www.youtube.com/watch?v=Bez-2cvYja0

imec has coined the term CMOS 2.0:

LEUVEN (Belgium), MARCH 12th, 2026 rCo Imec,
a world-leading research and innovation hub
in advanced semiconductor technologies, has
launched a first-of-its-kind consortium with
26 European university groups that will jointly
work on the technology roadmap beyond
CMOS scaling (CMOS 2.0). https://www.imec-int.com/en/press/imec-launches-university-consortium-around-next-generation-chips

So we might see more mobile grade GPUs.

Bye

--- Synchronet 3.22a-Linux NewsLink 1.2

From Newsgroup: sci.physics

Hi,

3D RAM is already the new normal for SSDs.
Nearly all mainstream modern SSDs use 3D NAND
(or V-NAND), where billions of memory cells
are stacked vertically in skyscrapers
rather than being laid out flat.

The Story Behind V-NAND Memory Solution https://news.samsung.com/us/story-behind-samsungs-pioneering-v-nand-memory-solution

Unlike a traditional desktop or some
Windows laptops where you can slide an
NVMe M.2 drive into a slot, the MacBook
Neo has its 3D NAND chips permanently
soldered directly onto the laptop's motherboard.
There is no card or physical drive to pull out.

Instead of using a third-party SSD controller
chip (like Phison or Silicon Motion), the
storage logic is integrated directly into
the Apple A18 Pro processor. The processor
communicates with the soldered NAND storage
via a custom internal NVMe protocol over
a PCIe connection.

amsung's roadmap is truly ambitious, with
plans to launch the 11th generation of
NAND in 2027 with an estimated 50%
improvement in I/O rates, followed by
1,000-layer NAND chips by 2030. Its
competitor, SK hynix, is also working on
400-layer NAND aiming to have the technology
ready for mass production by the end of 2025,
as we previously mentioned in August.

https://www.techpowerup.com/328244/samsung-plans-400-layer-v-nand-for-2026-and-dram-technology-advancements-by-2027

Bye

Mild Shock schrieb:

Hi,

"Mobile HBM" refers to a new, under-development
form of High Bandwidth Memory (HBM) optimized
specifically for energy-efficient mobile devices
like smartphones. Manufacturers such as Samsung
and SK Hynix are developing this technology to
make the massive data bandwidth required for complex,
on-device AI applications available within the strict
power and space constraints of mobile phones.

Unlike classic HBM solutions, which rely on
extra-wide silicon interposers for massive data
throughput in data centers and graphics cards,
Mobile HBM utilizes stacked LPDDR architectures.
The goal is to drastically reduce power consumption
and heat generation so that large AI models can
run directly on the device (on-device) without
placing too heavy a load on the battery. The
technology is expected to hit the market starting
in 2026/2027, with Apple among those showing great
interest in integrating it into future iPhone generations."

https://www.remio.ai/post/mobile-hbm-the-ai-memory-tech-that-could-reshape-the-iphone

Just think of a Mac Neo, which has now 8 GB,
but the memory going 3D in 12 layers, thats a
massive of 96 GB very fast memory.

Economy of scale comes later, when the same CPU/
GPU/RAM combo is used for phones, tablets, desktop,
or with other humidity and temperature parameters

for cars, robots, drones, etc...

Bye

Mild Shock schrieb:

Hi,

For marketing purposes people
typically look at the race towards
2nm, and we find:

A month ago, Apple lost its exclusivity
on 3 nm smartphone processors with
MediaTekrCOs Dimensity 9400 chip, integrated
in the Vivo X200 Pro smartphone. Qualcomm
is also in the race with its recently
unveiled Snapdragon 8 Elite and set to
power the Xiaomi 15 Pro in 2025. However,
Apple should regain its position as innovation
leader in 2026 with the release of the
iPhone 18, which should feature the A20
chip built on TSMCrCOs 2 nm process."

But there is a vertical vias revolution
going on as well, some SOCs typically
being at 18 layers now:

Zooming Into a CPU (It's Incredible)
https://www.youtube.com/watch?v=Bez-2cvYja0

imec has coined the term CMOS 2.0:

LEUVEN (Belgium), MARCH 12th, 2026 rCo Imec,
a world-leading research and innovation hub
in advanced semiconductor technologies, has
launched a first-of-its-kind consortium with
26 European university groups that will jointly
work on the technology roadmap beyond
CMOS scaling (CMOS 2.0).
https://www.imec-int.com/en/press/imec-launches-university-consortium-around-next-generation-chips


So we might see more mobile grade GPUs.

Bye

--- Synchronet 3.22a-Linux NewsLink 1.2

From Newsgroup: sci.physics

Hi,

Where the hell do you read something RDMA,
in a post about on-device memory.

I didn't post anything about RDMA in the
below, still you go on a tangent,

like a mad hutter, worse than CCCP troll
micro penis. Could it be that UK and

Brexit turned people into even more paranoid
figures than than the CCCP break up?

BYe

Mild Shock schrieb:

Hi,

"Mobile HBM" refers to a new, under-development
form of High Bandwidth Memory (HBM) optimized
specifically for energy-efficient mobile devices
like smartphones. Manufacturers such as Samsung
and SK Hynix are developing this technology to
make the massive data bandwidth required for complex,
on-device AI applications available within the strict
power and space constraints of mobile phones.

Unlike classic HBM solutions, which rely on
extra-wide silicon interposers for massive data
throughput in data centers and graphics cards,
Mobile HBM utilizes stacked LPDDR architectures.
The goal is to drastically reduce power consumption
and heat generation so that large AI models can
run directly on the device (on-device) without
placing too heavy a load on the battery. The
technology is expected to hit the market starting
in 2026/2027, with Apple among those showing great
interest in integrating it into future iPhone generations."

https://www.remio.ai/post/mobile-hbm-the-ai-memory-tech-that-could-reshape-the-iphone

Just think of a Mac Neo, which has now 8 GB,
but the memory going 3D in 12 layers, thats a
massive of 96 GB very fast memory.

Economy of scale comes later, when the same CPU/
GPU/RAM combo is used for phones, tablets, desktop,
or with other humidity and temperature parameters

for cars, robots, drones, etc...

Bye

Mild Shock schrieb:

Hi,

For marketing purposes people
typically look at the race towards
2nm, and we find:

A month ago, Apple lost its exclusivity
on 3 nm smartphone processors with
MediaTekrCOs Dimensity 9400 chip, integrated
in the Vivo X200 Pro smartphone. Qualcomm
is also in the race with its recently
unveiled Snapdragon 8 Elite and set to
power the Xiaomi 15 Pro in 2025. However,
Apple should regain its position as innovation
leader in 2026 with the release of the
iPhone 18, which should feature the A20
chip built on TSMCrCOs 2 nm process."

But there is a vertical vias revolution
going on as well, some SOCs typically
being at 18 layers now:

Zooming Into a CPU (It's Incredible)
https://www.youtube.com/watch?v=Bez-2cvYja0

imec has coined the term CMOS 2.0:

LEUVEN (Belgium), MARCH 12th, 2026 rCo Imec,
a world-leading research and innovation hub
in advanced semiconductor technologies, has
launched a first-of-its-kind consortium with
26 European university groups that will jointly
work on the technology roadmap beyond
CMOS scaling (CMOS 2.0).
https://www.imec-int.com/en/press/imec-launches-university-consortium-around-next-generation-chips


So we might see more mobile grade GPUs.

Bye

RDMA and the like basically give up "memory protection" for "sharing".

Not everybody is interested in "sharing" their memory,
which is the state of the world, with others,
in terms of RAM or memory and DISK or the durable.

So, it's a sort of "devolution", in terms of systems with
protections and multiple users, in terms of one big fat user.

It's like the king with all the keys to the kingdom
banning locks so to not be lugging around all the keys,
then whether he's one-eyed.

Shut Up

Mature, efficient economies basically have an interest rate of zero,
like Switzerland and how Japan was. Non-zero rates are a sign
of market inefficiencies and inversions.

Shut Up

--- Synchronet 3.22a-Linux NewsLink 1.2

From Newsgroup: sci.physics

Hi,

Hey Rossy Boy and Micro Penis, maybe choose
another hobby than computer science. Your
brains are completely foggy, you cannot

concentrate on AI and software engineering.
You should go back to cruising gay bars.
It seems you are constantly in a state

of some cyber crime conspiration. LoL

Bye

Mild Shock schrieb:

Hi,

Where the hell do you read something RDMA,
in a post about on-device memory.

I didn't post anything about RDMA in the
below, still you go on a tangent,

like a mad hutter, worse than CCCP troll
micro penis. Could it be that UK and

Brexit turned people into even more paranoid
figures than than the CCCP break up?

BYe

Mild Shock schrieb:

Hi,

"Mobile HBM" refers to a new, under-development
form of High Bandwidth Memory (HBM) optimized
specifically for energy-efficient mobile devices
like smartphones. Manufacturers such as Samsung
and SK Hynix are developing this technology to
make the massive data bandwidth required for complex,
on-device AI applications available within the strict
power and space constraints of mobile phones.

Unlike classic HBM solutions, which rely on
extra-wide silicon interposers for massive data
throughput in data centers and graphics cards,
Mobile HBM utilizes stacked LPDDR architectures.
The goal is to drastically reduce power consumption
and heat generation so that large AI models can
run directly on the device (on-device) without
placing too heavy a load on the battery. The
technology is expected to hit the market starting
in 2026/2027, with Apple among those showing great
interest in integrating it into future iPhone generations."

https://www.remio.ai/post/mobile-hbm-the-ai-memory-tech-that-could-reshape-the-iphone


Just think of a Mac Neo, which has now 8 GB,
but the memory going 3D in 12 layers, thats a
massive of 96 GB very fast memory.

Economy of scale comes later, when the same CPU/
GPU/RAM combo is used for phones, tablets, desktop,
or with other humidity and temperature parameters

for cars, robots, drones, etc...

Bye

Mild Shock schrieb:

Hi,

For marketing purposes people
typically look at the race towards
2nm, and we find:

A month ago, Apple lost its exclusivity
on 3 nm smartphone processors with
MediaTekrCOs Dimensity 9400 chip, integrated
in the Vivo X200 Pro smartphone. Qualcomm
is also in the race with its recently
unveiled Snapdragon 8 Elite and set to
power the Xiaomi 15 Pro in 2025. However,
Apple should regain its position as innovation
leader in 2026 with the release of the
iPhone 18, which should feature the A20
chip built on TSMCrCOs 2 nm process."

But there is a vertical vias revolution
going on as well, some SOCs typically
being at 18 layers now:

Zooming Into a CPU (It's Incredible)
https://www.youtube.com/watch?v=Bez-2cvYja0

imec has coined the term CMOS 2.0:

LEUVEN (Belgium), MARCH 12th, 2026 rCo Imec,
a world-leading research and innovation hub
in advanced semiconductor technologies, has
launched a first-of-its-kind consortium with
26 European university groups that will jointly
work on the technology roadmap beyond
CMOS scaling (CMOS 2.0).
https://www.imec-int.com/en/press/imec-launches-university-consortium-around-next-generation-chips


So we might see more mobile grade GPUs.

Bye

RDMA and the like basically give up "memory protection" for "sharing".

Not everybody is interested in "sharing" their memory,
which is the state of the world, with others,
in terms of RAM or memory and DISK or the durable.


So, it's a sort of "devolution", in terms of systems with
protections and multiple users, in terms of one big fat user.


It's like the king with all the keys to the kingdom
banning locks so to not be lugging around all the keys,
then whether he's one-eyed.


Shut Up




Mature, efficient economies basically have an interest rate of zero,
like Switzerland and how Japan was. Non-zero rates are a sign
of market inefficiencies and inversions.



Shut Up

--- Synchronet 3.22a-Linux NewsLink 1.2

From Newsgroup: sci.physics

Hi,

Ok, maybe as a UK citizen cruise gay bars,
same for a CCCP member, could indeed pose
a cyber treat. You might end up like Alan

Turing, with removed testicles.

Although nobody would notice in the case
of Rossy Boy and Micro Penis. They have
anyways their testicles already removed.

Maybe a better hobby is indeed a dog!

Have Fun!

Bye

Mild Shock schrieb:

Hi,

Hey Rossy Boy and Micro Penis, maybe choose
another hobby than computer science. Your
brains are completely foggy, you cannot

concentrate on AI and software engineering.
You should go back to cruising gay bars.
It seems you are constantly in a state

of some cyber crime conspiration. LoL

Bye

Mild Shock schrieb:

Hi,

Where the hell do you read something RDMA,
in a post about on-device memory.

I didn't post anything about RDMA in the
below, still you go on a tangent,

like a mad hutter, worse than CCCP troll
micro penis. Could it be that UK and

Brexit turned people into even more paranoid
figures than than the CCCP break up?

BYe

Mild Shock schrieb:

Hi,

"Mobile HBM" refers to a new, under-development
form of High Bandwidth Memory (HBM) optimized
specifically for energy-efficient mobile devices
like smartphones. Manufacturers such as Samsung
and SK Hynix are developing this technology to
make the massive data bandwidth required for complex,
on-device AI applications available within the strict
power and space constraints of mobile phones.

Unlike classic HBM solutions, which rely on
extra-wide silicon interposers for massive data
throughput in data centers and graphics cards,
Mobile HBM utilizes stacked LPDDR architectures.
The goal is to drastically reduce power consumption
and heat generation so that large AI models can
run directly on the device (on-device) without
placing too heavy a load on the battery. The
technology is expected to hit the market starting
in 2026/2027, with Apple among those showing great
interest in integrating it into future iPhone generations."

https://www.remio.ai/post/mobile-hbm-the-ai-memory-tech-that-could-reshape-the-iphone


Just think of a Mac Neo, which has now 8 GB,
but the memory going 3D in 12 layers, thats a
massive of 96 GB very fast memory.

Economy of scale comes later, when the same CPU/
GPU/RAM combo is used for phones, tablets, desktop,
or with other humidity and temperature parameters

for cars, robots, drones, etc...

Bye

Mild Shock schrieb:

Hi,

For marketing purposes people
typically look at the race towards
2nm, and we find:

A month ago, Apple lost its exclusivity
on 3 nm smartphone processors with
MediaTekrCOs Dimensity 9400 chip, integrated
in the Vivo X200 Pro smartphone. Qualcomm
is also in the race with its recently
unveiled Snapdragon 8 Elite and set to
power the Xiaomi 15 Pro in 2025. However,
Apple should regain its position as innovation
leader in 2026 with the release of the
iPhone 18, which should feature the A20
chip built on TSMCrCOs 2 nm process."

But there is a vertical vias revolution
going on as well, some SOCs typically
being at 18 layers now:

Zooming Into a CPU (It's Incredible)
https://www.youtube.com/watch?v=Bez-2cvYja0

imec has coined the term CMOS 2.0:

LEUVEN (Belgium), MARCH 12th, 2026 rCo Imec,
a world-leading research and innovation hub
in advanced semiconductor technologies, has
launched a first-of-its-kind consortium with
26 European university groups that will jointly
work on the technology roadmap beyond
CMOS scaling (CMOS 2.0).
https://www.imec-int.com/en/press/imec-launches-university-consortium-around-next-generation-chips


So we might see more mobile grade GPUs.

Bye

RDMA and the like basically give up "memory protection" for "sharing".

Not everybody is interested in "sharing" their memory,
which is the state of the world, with others,
in terms of RAM or memory and DISK or the durable.


So, it's a sort of "devolution", in terms of systems with
protections and multiple users, in terms of one big fat user.


It's like the king with all the keys to the kingdom
banning locks so to not be lugging around all the keys,
then whether he's one-eyed.


Shut Up




Mature, efficient economies basically have an interest rate of zero,
like Switzerland and how Japan was. Non-zero rates are a sign
of market inefficiencies and inversions.



Shut Up

--- Synchronet 3.22a-Linux NewsLink 1.2