• This new memory chip survives 700 degrees C

    From Jan Panteltje@alien@comet.invalid to sci.electronics.design on Thu Apr 9 07:37:04 2026
    From Newsgroup: sci.electronics.design

    From:
    https://www.sciencedaily.com/releases/2026/04/260406192904.htm

    This new chip survives 1300-#F (700-#C) and could change AI forever
    A heat-proof memory device that thrives at 700-#C could transform everything from space exploration to AI computing.
    Date:
    April 7, 2026
    Source:
    University of Southern California
    Summary:
    A team of engineers has created a breakthrough memory device that keeps working at temperatures hotter than molten lava,
    shattering one of electronicsrCO biggest limits. Built from an unusual stack of ultra-durable materials,
    the tiny component can store data and perform calculations even at 700-#C (1300-#F), far beyond what todayrCOs chips can handle.
    The discovery was partly accidental, but it revealed a powerful new mechanism that prevents heat-induced failure at the atomic level.

    Memristors, fast matrix multiplication, cheaper AI memory.
    --- Synchronet 3.21f-Linux NewsLink 1.2
  • From Bill Sloman@bill.sloman@ieee.org to sci.electronics.design on Mon Apr 13 12:04:15 2026
    From Newsgroup: sci.electronics.design

    On 9/04/2026 5:37 pm, Jan Panteltje wrote:
    From:
    https://www.sciencedaily.com/releases/2026/04/260406192904.htm

    This new chip survives 1300-#F (700-#C) and could change AI forever
    A heat-proof memory device that thrives at 700-#C could transform everything from space exploration to AI computing.
    Date:
    April 7, 2026
    Source:
    University of Southern California
    Summary:
    A team of engineers has created a breakthrough memory device that keeps working at temperatures hotter than molten lava,
    shattering one of electronicsrCO biggest limits. Built from an unusual stack of ultra-durable materials,
    the tiny component can store data and perform calculations even at 700-#C (1300-#F), far beyond what todayrCOs chips can handle.
    The discovery was partly accidental, but it revealed a powerful new mechanism that prevents heat-induced failure at the atomic level.

    Memristors, fast matrix multiplication, cheaper AI memory.

    That looks like a very interesting result. Mass producing the graphene
    layer may be tricky, but high temperature electronics could have lot of different application.

    Tungsten has the highest melting point of any element, 3,695 K. Hafnium
    oxide melts at 3,031 K, so it isn't far behind.
    --
    Bill Sloman, Sydney
    --- Synchronet 3.21f-Linux NewsLink 1.2
  • From Jeroen Belleman@jeroen@nospam.please to sci.electronics.design on Mon Apr 13 11:15:34 2026
    From Newsgroup: sci.electronics.design

    On 4/13/26 04:04, Bill Sloman wrote:
    On 9/04/2026 5:37 pm, Jan Panteltje wrote:
    From:
    -a https://www.sciencedaily.com/releases/2026/04/260406192904.htm
    This new chip survives 1300-#F (700-#C) and could change AI forever
    A heat-proof memory device that thrives at 700-#C could transform
    everything from space exploration to AI computing.
    Date:
    -a April 7, 2026
    Source:
    -a University of Southern California
    Summary:
    -a A team of engineers has created a breakthrough memory device that
    keeps working at temperatures hotter than molten lava,
    -a shattering one of electronicsrCO biggest limits. Built from an unusual >> stack of ultra-durable materials,
    -a the tiny component can store data and perform calculations even at
    700-#C (1300-#F), far beyond what todayrCOs chips can handle.
    -a The discovery was partly accidental, but it revealed a powerful new
    mechanism that prevents heat-induced failure at the atomic level.

    Memristors, fast matrix multiplication, cheaper AI memory.

    That looks like a very interesting result. Mass producing the graphene
    layer may be tricky, but high temperature electronics could have lot of different application.

    Tungsten has the highest melting point of any element, 3,695 K. Hafnium oxide melts at 3,031 K, so it isn't far behind.


    Frankly, this reads like a belated April fools day joke.
    "It dould change AI forever", right!

    Jeroen Belleman
    --- Synchronet 3.21f-Linux NewsLink 1.2
  • From Bill Sloman@bill.sloman@ieee.org to sci.electronics.design on Tue Apr 14 03:06:19 2026
    From Newsgroup: sci.electronics.design

    On 13/04/2026 7:15 pm, Jeroen Belleman wrote:
    On 4/13/26 04:04, Bill Sloman wrote:
    On 9/04/2026 5:37 pm, Jan Panteltje wrote:
    From:
    -a https://www.sciencedaily.com/releases/2026/04/260406192904.htm
    This new chip survives 1300-#F (700-#C) and could change AI forever
    A heat-proof memory device that thrives at 700-#C could transform
    everything from space exploration to AI computing.
    Date:
    -a April 7, 2026
    Source:
    -a University of Southern California
    Summary:
    -a A team of engineers has created a breakthrough memory device that
    keeps working at temperatures hotter than molten lava,
    -a shattering one of electronicsrCO biggest limits. Built from an
    unusual stack of ultra-durable materials,
    -a the tiny component can store data and perform calculations even at
    700-#C (1300-#F), far beyond what todayrCOs chips can handle.
    -a The discovery was partly accidental, but it revealed a powerful new
    mechanism that prevents heat-induced failure at the atomic level.

    Memristors, fast matrix multiplication, cheaper AI memory.

    That looks like a very interesting result. Mass producing the graphene
    layer may be tricky, but high temperature electronics could have lot
    of different application.

    Tungsten has the highest melting point of any element, 3,695 K.
    Hafnium oxide melts at 3,031 K, so it isn't far behind.


    Frankly, this reads like a belated April fools day joke.
    "It could change AI forever", right!

    University publicity departments aren't great at checking their
    publicity puffs with the people whose work they imagine that they are publicising. Any publicity clown has to put in a reference to AI these
    days. The point about a layer of graphene blocking the usual solid state diffusion is what got my attention. Whether this is the right way of
    looking at the results is likely to get tested - it's an interesting
    result, but so were the results that triggered the cold fusion
    controversy. Some odd results are just odd.
    --
    Bill Sloman, Sydney
    --- Synchronet 3.21f-Linux NewsLink 1.2
  • From =?UTF-8?Q?Niocl=C3=A1s_P=C3=B3l_Caile=C3=A1n?= de Ghloucester@thanks-to@Taf.com to sci.electronics.design on Mon Apr 13 17:38:15 2026
    From Newsgroup: sci.electronics.design

    Bill Sloman <Bill.Sloman@IEEE.org> wrote: |----------------------------------------------------------------------| |"University publicity departments aren't great at checking their | |publicity puffs with the people whose work they imagine that they are | |publicising. [. . .]" | |----------------------------------------------------------------------|

    True.
    (S. HTTP://Gloucester.Insomnia247.NL/ fuer Kontaktdaten!)
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