From Newsgroup: sci.electronics.design
On 6/3/26 9:00 AM, Jan Panteltje wrote:
From:
https://www.sciencedaily.com/releases/2026/05/260530053412.htm
New 3D silicon chip breakthrough could extend MoorerCOs Law for years
Date:
May 30, 2026
Source:
University of Illinois Grainger College of Engineering
Summary:
As traditional chip miniaturization slows, researchers have found a way to
pack more computing power into the same space by stacking silicon circuits
in multiple layers.
The new process uses ultra-thin silicon membranes and low-temperature
manufacturing techniques to overcome a major obstacle that has long
blocked the production of true 3D chips.
Will it work?
dissipation?
Last week Huawei announced this (from brave search):
"Huawei has unveiled the LogicFolding chip architecture and the Tau
Scaling Law, a new design framework intended to bypass US sanctions by focusing on signal propagation speed rather than traditional transistor miniaturization. This approach aims to achieve transistor density
equivalent to 1.4nm chips by 2031, though the immediate commercial
application will be the Kirin 2026 smartphone chip launching in fall 2026."
Reuters has a decent article, and I've seen at least one youtube video
on it that I'm pretty sure said they had working prototype chips now and expect full production this fall. Wonder how the UI process compares?
--
Regards,
Carl
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