From Newsgroup: sci.electronics.design

This new 3D chip could break AIrCOs biggest bottleneck
Date:
December 24, 2025
Source:
Stanford University
Summary:
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically,
dramatically speeding up how data moves inside the chip.
Unlike traditional flat designs, this approach avoids the traffic jams that limit todayrCOs AI hardware.
The prototype already beats comparable chips by several times, with future versions expected to go much further.
Just as important, it was manufactured entirely in a U.S. foundry,
showing the technology is ready for real-world production.
Link:
https://www.sciencedaily.com/releases/2025/12/251223084857.htm

?Really?
--- Synchronet 3.21a-Linux NewsLink 1.2