• Re: DRAM Chiplet for L3 cache?

    From Stephen Fuld@21:1/5 to Michael S on Tue Jan 28 11:17:45 2025
    On 1/27/2025 1:48 PM, Michael S wrote:
    On Mon, 27 Jan 2025 17:18:29 GMT
    anton@mips.complang.tuwien.ac.at (Anton Ertl) wrote:

    Stephen Fuld <sfuld@alumni.cmu.edu.invalid> writes:
    This brings up the question of why, at least so far, no one is using
    a DRAM chiplet (i.e. one made with a DRAM specialized technology),
    for the L3 cache. ISTM that the advantage of being able to put a
    much higher capacity cache in the same physical size chiplet is
    substantial.

    There used to be eDRAM used for an L4 cache ("Crystall Well") in some
    Intel Broadwell and Skylake variants, as well as eDRAM used as L3
    cache on Power8.

    In Power7/8/9 eDRAM is a part of proccessor die, so not quite the same
    as OP's suggestion.

    True, but as the OP, I give him some slack. I probably wasn't clear. I
    had originally intended to mean using a chiplet manufactured on a DRAM
    process in order to reduce cost per bit, perhaps by using actual
    existing, though possibly slightly modified commodity DRAM die, not
    eDRAM. The article does a good job of explaining why this isn't a good
    idea.

    --
    - Stephen Fuld
    (e-mail address disguised to prevent spam)

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  • From MitchAlsup1@21:1/5 to All on Wed Jan 29 17:08:26 2025
    There were at least 3 times when I wanted to use DRAM as cache.

    Even refreshing a row every other cycle was insufficient for
    any of the test engineers to sign off on being able to properly
    test DRAM on a chip containing CPU cores.

    I had even gone to the point of designing* and laying out the
    DRAM cells, word line drivers, sense amplifiers, and bit-line
    prechargers.

    (*) SPICE.

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  • From Scott Lurndal@21:1/5 to Stephen Fuld on Mon Jan 27 17:07:30 2025
    Stephen Fuld <sfuld@alumni.cmu.edu.invalid> writes:
    One of the advantages of using chiplets instead of a large monolithic
    chip is that you can use functionality made with different foundry >technologies.

    This brings up the question of why, at least so far, no one is using a
    DRAM chiplet (i.e. one made with a DRAM specialized technology), for the
    L3 cache. ISTM that the advantage of being able to put a much higher >capacity cache in the same physical size chiplet is substantial.

    At additional development cost for doing the link training, a power cost
    to support refresh and a performance cost due to the additional latency.

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  • From Stephen Fuld@21:1/5 to All on Mon Jan 27 08:55:35 2025
    One of the advantages of using chiplets instead of a large monolithic
    chip is that you can use functionality made with different foundry technologies.

    This brings up the question of why, at least so far, no one is using a
    DRAM chiplet (i.e. one made with a DRAM specialized technology), for the
    L3 cache. ISTM that the advantage of being able to put a much higher
    capacity cache in the same physical size chiplet is substantial.


    --
    - Stephen Fuld
    (e-mail address disguised to prevent spam)

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  • From Anton Ertl@21:1/5 to Stephen Fuld on Mon Jan 27 17:18:29 2025
    Stephen Fuld <sfuld@alumni.cmu.edu.invalid> writes:
    This brings up the question of why, at least so far, no one is using a
    DRAM chiplet (i.e. one made with a DRAM specialized technology), for the
    L3 cache. ISTM that the advantage of being able to put a much higher >capacity cache in the same physical size chiplet is substantial.

    There used to be eDRAM used for an L4 cache ("Crystall Well") in some
    Intel Broadwell and Skylake variants, as well as eDRAM used as L3
    cache on Power8. There is an insightfull article on Crystal Well (as
    well as a little bit about Power8): <https://old.chipsandcheese.com/2024/11/01/broadwells-edram-vcache-before-vcache-was-cool/>,
    which also provides an explanation why this technology is no longer
    used.

    In a recent article <https://old.chipsandcheese.com/2025/01/18/inside-the-amd-radeon-instinct-mi300as-giant-memory-subsystem/>
    they look at how a memory-side SRAM cache performs in the MI300A. For
    CPUs you really want to have the cache on the core side.

    - anton
    --
    'Anyone trying for "industrial quality" ISA should avoid undefined behavior.'
    Mitch Alsup, <c17fcd89-f024-40e7-a594-88a85ac10d20o@googlegroups.com>

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  • From Stephen Fuld@21:1/5 to Anton Ertl on Mon Jan 27 11:14:46 2025
    On 1/27/2025 9:18 AM, Anton Ertl wrote:
    Stephen Fuld <sfuld@alumni.cmu.edu.invalid> writes:
    This brings up the question of why, at least so far, no one is using a
    DRAM chiplet (i.e. one made with a DRAM specialized technology), for the
    L3 cache. ISTM that the advantage of being able to put a much higher
    capacity cache in the same physical size chiplet is substantial.

    There used to be eDRAM used for an L4 cache ("Crystall Well") in some
    Intel Broadwell and Skylake variants, as well as eDRAM used as L3
    cache on Power8. There is an insightfull article on Crystal Well (as
    well as a little bit about Power8): <https://old.chipsandcheese.com/2024/11/01/broadwells-edram-vcache-before-vcache-was-cool/>,
    which also provides an explanation why this technology is no longer
    used.

    Thank you Anton. You're right, that article is excellent. I knew about
    the eDRAM used in some Power systems, but not Intel's use. The article explains the issues very well. It seems like one of those things that
    sounds good at first, but as you get into the details, the problems
    become more evident, and the paper illustrated that very well.


    --
    - Stephen Fuld
    (e-mail address disguised to prevent spam)

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  • From Michael S@21:1/5 to Anton Ertl on Mon Jan 27 23:48:57 2025
    On Mon, 27 Jan 2025 17:18:29 GMT
    anton@mips.complang.tuwien.ac.at (Anton Ertl) wrote:

    Stephen Fuld <sfuld@alumni.cmu.edu.invalid> writes:
    This brings up the question of why, at least so far, no one is using
    a DRAM chiplet (i.e. one made with a DRAM specialized technology),
    for the L3 cache. ISTM that the advantage of being able to put a
    much higher capacity cache in the same physical size chiplet is >substantial.

    There used to be eDRAM used for an L4 cache ("Crystall Well") in some
    Intel Broadwell and Skylake variants, as well as eDRAM used as L3
    cache on Power8.

    In Power7/8/9 eDRAM is a part of proccessor die, so not quite the same
    as OP's suggestion.

    In some of IBM's mainframe processors eDRAM is present both as on-die
    L2 and L3 caches and as on package L4 cache. I don't remember an exact
    number of this CPU.

    There is an insightfull article on Crystal Well (as
    well as a little bit about Power8): <https://old.chipsandcheese.com/2024/11/01/broadwells-edram-vcache-before-vcache-was-cool/>,
    which also provides an explanation why this technology is no longer
    used.

    In a recent article <https://old.chipsandcheese.com/2025/01/18/inside-the-amd-radeon-instinct-mi300as-giant-memory-subsystem/>
    they look at how a memory-side SRAM cache performs in the MI300A. For
    CPUs you really want to have the cache on the core side.

    - anton

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